CMP, often called thermal oxidation sprucing, utilizes MP in conjunction with substances to improve the MRR and improve area high quality [20]. Determine two illustrates the schematic of an average CMP process [21]. The SiC wafer, which can be mounted about the carrier, as well as the sprucing pad go https://www.facebook.com/permalink.php?story_fbid=pfbid0vuY47mVAJy6xu3SK1ZxACHZWQJconX3a8FZ1nP6MPCJj8jnt6HRFfFSx3j9vpWNpl&id=61560512640678&__cft__[0]=AZWxYZF78LtuBO4rXfMC4EMcvnNrboNKejseS0EokfSx3psaGlwOWqHkfZaZYlY_LUnQHyu-92TVzZi-xf0Eojwh5p6Xl3E4aFZYoflkdL0SjDe1Nu3KNaE2RLbdeSTZXykXXS2BV5I_hjUxtkcD6DSjNiOe74u2QEXBcuWbGwOXToVN14FshfRJJVrcpBM1Xz0fTvBGBAd4Al8KzL-fnVSs&__tn__=%2CO%2CP-R